RENEX Group promotes efficient use of preform technology in solder paste application

Preforms, which are metallic elements integrated with solder paste, come in a wide range of chip sizes—from 0.1 mm to 0.6 mm. Their unique properties allow for a significant reduction in voids that form during the surface mount technology (SMT) process, often reducing them by 20-25%. This ensures better thermal conductivity and mechanical stability of solder joints, which is crucial for many electronic applications.

Besides their traditional use in solder pastes, Indium Corporation’s preforms are also utilized in thermal management in advanced electronic devices. They serve as an alternative to thermal greases and gels, offering a thermal conductivity coefficient of 86 watts per meter Kelvin, far surpassing standard solutions. This makes them ideal for applications requiring intensive heat transfer and they can be customized to meet clients’ specific requirements in terms of shape and thickness.

RENEX Group encourages taking advantage of the opportunities offered by Indium’s preforms, providing comprehensive support in the selection and implementation of these components. The company is capable of delivering solutions that not only meet but exceed customer expectations, regardless of the specifics of their projects. With experience and commitment to delivering the latest technologies, RENEX Group is an effective partner in designing efficient electronic systems.

Customers interested in collaboration or in need of further information are encouraged to contact RENEX Group’s Technical Sales Advisors, who are ready to answer any questions and support the implementation of projects that utilize advanced thermal and soldering technologies.