von Łukasz Pietrzak | Okt 22, 2005 | Pressemeldungen
The previous part of the article presents the basic problems related to lead-free soldering, as well as ways of solving them. Below we continue the topic, indicating how apparently insignificant details of the construction of soldering stations can significantly...
von Łukasz Pietrzak | Sep 21, 2005 | Pressemeldungen
In the offer of manufacturers of devices for assembly and disassembly of electronic circuits there are many different types of soldering stations and similar tools, but only some of them allow for fully professional work with lead-free solders. Probably many...
von Łukasz Pietrzak | Jun 21, 2005 | Pressemeldungen
Every electronics engineer is aware of the widespread use of SMD components, especially BGA, which are used in mass production of electronic devices. The complexity of products such as mobile phones or laptops makes it necessary to struggle with increasingly complex...
von Łukasz Pietrzak | Nov 20, 2003 | Pressemeldungen
PREVENTION OF COLD SOLDER The condition for a proper connection is the cleanliness of the surfaces to be connected, the presence of flux and a sufficiently high temperature to dissolve the copper layer in the tin. Meanwhile, various aggressive chemicals, including...
von Łukasz Pietrzak | Apr 15, 2003 | Pressemeldungen
Technical capabilities of machines and equipment used in production determine the levels of complexity, precision and efficiency of technological processes achieved, and finally – the quality of products. However, the market success of a product does not only...
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