As announced by its distributor, RENEX Group, YAMAHA has introduced yet another new addition to its SMT portfolio – New i-Cube10 (YRH10) Hybrid Placer. According to the manufacturer, the completely new design achieves 50% more assembly accuracy and production capacity than previous models.
The SMT Section of YAMAHA Motor Europe, has launched a new hybrid i-Cube10 placer (YRH10). The device features both surface mount functions for electronic components and a die bonder for wafer components. The i-Cube10 (YRH10) was developed as a successor to the i-CubeIID (YHP-2D). The new model retains the same high compatibility to work with a wide range of electronic components and semiconductor packages, achieving more than 50% higher production capacity and assembly precision.
Market Background and Product Outline
At the worksites for mounting electronic components and semiconductor packages in recent years, the trends of making things smaller and thinner, lowering power consumption, achieving higher functionality, and greater diversification are accelerating rapidly, and the implementation of even more delicate processes is progressing. In turn, the market is now looking not only for higher mounting accuracy than ever before, but also improved productivity.
The newly developed i-Cube10 (YRH10) represents the first design change in 14 years – since 2007 – and is a rapid response to these changes and market demands. The device achieves a 50% improvement over previous models in both assembly accuracy and productivity, allowing different types of surface mount components and wafer components to be mounted with a single device.
Product Features
1) High-speed, high-precision mounting
Operation of the mounting head and wafer camera has been optimized, eliminating all standby time loss of the mutual units. In addition, by equipping the head with a scan camera, component recognition following wafer picking is completed during movement and taking the shortest path to the mounting position becomes possible, creating an efficient operations cycle. Further, the number of nozzles on the mounting head has been increased from 4 to 10, drastically reducing of the number of head cycles needed per number of components to be mounted. Thanks to these features, the i-Cube10 (YRH10) achieves a high bare chip mounting speed of 10,800 CPH (when supplying wafers).
The wafer replacement time has also been shortened, and even multi-die products requiring frequent wafer replacement can be produced without reducing throughput. This unit also aids in achieving high-quality production by effectively utilizing our recognition system for ball/bump components, refined through the development of our flip-chip bonders such as the YSB55w.
Additionally, the rigidity of the frame was extensively reviewed. A high-rigidity conveyor was adopted to reduce its dynamic vibration during head operation and optimization of axis control parameters, a heat compensation feature and more achieve and maintain the unit’s high mounting accuracy of ±15 μm (μ+3σ).
2) High versatility
Since various types of components such as surface mount devices and wafer components can be mounted with the i-Cube10 (YRH10), a single unit can be used for mounting operations instead of having to divide tasks among multiple devices as was required before. This reduces costs and installation space. The unit is also equipped with a variety of functions facilitating its high versatility, such as a non-stop wafer feed unit that can set up to 10 wafers, compatibility with PCBs up to L330 mm × W250 mm in size, automatic tool replacement, and a dual push-up unit. In addition, the i-Cube10 (YRH10) is also compatible with the auto-loading feeder Yamaha surface mounters are known for, and can always supply tape reel components without stopping production or requiring supply timing selection.
EXCLUSIVE DISTRIBUTOR PF YAMAHA SMT and YAMAHA ROBOTICS – RENEX Group
RENEX Group is the exclusive distributor of YAMAHA SMT and YAMAHA ROBOTICS in Poland and Central and Eastern Europe. YAMAHA equipment, including industrial robots, SMT production equipment, SCARA robots and other products from the RENEX offer can be seen and tested in operation in the test conditions of production lines (also with own components and subassemblies) in RENEX TECHNICAL CENTER and DEMOROOM. Apart from the equipment, RENEX Group provides a comprehensive range of consulting and advisory services in the field of automation of production processes.
The Center also conducts training in programming and operation of both SMT devices and industrial robots. If you are interested, please contact RENEX Group Technical and Sales Consultants – dth@renex.pl.