If we take a closer look at modern, mass-produced electronic devices, we will find that their manufacturers are using chronic elements less and less frequently. The dominance of SMT technology and ubiquitous miniaturization have made SMD components smaller and smaller. Just a few years ago probably nobody thought that BGA chipsets could be 6×6 mm in size, and it was the smallest controller of a USB 3.0 hub that was placed in a chassis of such dimensions. Such a trend means that the service technicians are already facing a challenge.
Manual component mounting and dismounting devices including the manual positioning option are not suitable for working with components in such small chips, and certainly not in the smallest ones. μBGA and μCHIP enclosures. More specialized equipment is needed here, which performs part of the work automatically or semi-automatically. The question is, which device should be chosen to suit the work being carried out, the service specialisation and the budget available to the investor?
REPLACEMENT OF SMALL COMPONENTS
The American company VJ Electronix has launched Summit Micra, which fits perfectly into the micro-component exchange market. The company has extensive experience in manufacturing BGA replacement systems, but also in X-ray inspection. The Micra system uses the latest technologies in the repair of electronic components such as PoP (Package on Package), QFN, CSP, metal screens or passive 01005 components. They can be found in smartphones, netbooks, GPS devices, cameras, digital cameras, tablets, e-book readers or other portable devices commonly used today. The Micra system is not only a machine for working with small PCBs. Its design provides support for PCBs with dimensions up to 300×350 mm. High efficiency of repairs is ensured by built-in convection heaters, both from the bottom and the top.
An additional advantage is the possibility of using the zone bottom heater. The device is equipped with HD camera with two-color LED lighting. Such system provides a larger field of view, extending the range of possible applications to include products for the automotive, medical, defense and aviation industries.
MICRO SCAVENGING
The Micro Scavenging function is dedicated to removing solder residue from both large, asymmetrical soldering pads and the smallest, densely distributed passive element pads. Automated and computer-controlled control of the entire process and the temperature guarantees perfect cleaning of the soldering points without risk of damage.
The above mentioned advantages of the presented device make it applicable to practically every workshop, even those operating in a 24/24 system. Micra system is equipped with easy to use SierraMate V9 software allowing for defining particular stages and data of processes and automatic playback, reducing the need for training and profiling.
QUICK INSTALLATION INSPECTION
Any replacement of components must be verified. Under typical service conditions, occasionally replacing passive or active components, an inspection with a stereomicroscope or a more advanced video microscope is sufficient. However, even a highly specialised microscope does not provide BGA inspection. Therefore, an important addition to the advanced service line is the X-ray system.
The most suitable device for service applications is the XQuik X-ray system from VJ Technologies. It is designed according to four principles: dimensions, capabilities, speed and ease of use. XQuik does not take up much space – its base has dimensions of only 67.3×67.3 cm. It allows you to store images in memory, share them in the cloud or save them on any media, making it easier to access inspection results.
The Vi3 software that runs on this system takes and transmits pictures to the monitor screen without delay, and the ease of configuration of the device makes operation fast and requires no additional training.
SUMMARY
Please note that the selection of a device is not determined by knowledge of the technical data alone. An important factor determining the purchase and equipment, is the possibility of checking individual devices in service or production conditions.
For this reason, Renex in the demo-room in Włocławek has been offering tests of devices on applications supplied by the customer for several years.
Thanks to the wide range of equipment available, we provide the possibility of simulating the assembly process and making trial batches of packages.
We select the entire process according to the principles defined by IPC standards and individual requirements.
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