Even though the reliability of modern electronics is high, a huge number of devices gives more and more orders to services. Running a service company has to be economically justified, for this reason, quick and efficient repairs are the benchmark for effectiveness, which can only be provided by versatile and affordable devices.
Especially working with BGA components, being much more difficult than with other SMD components, creates many complications. A large number of soldering points located under the housing of the circuit, makes it practically impossible to carry out assembly and disassembly by manual methods.
To avoid short circuits or breakages, the BGA system must be ideally positioned before soldering, it is also necessary to use soldering technology as close as possible to the production conditions existing in multi-zone reflow ovens (preheating, heating, heating proper, cooling down). The most popular way of assembling and disassembling BGA components is by blowing hot air stream. This method is widely used in both manufacturing and repair companies. Many service companies are struggling with BGA using tools such as simple hot-air blowing stations and even electric heat guns.
Uniform heating of e.g. 700 soldering balls requires great precision in process control, so this struggle is usually lost, and service costs and damaged components fall on the budget for a long time or force further repairs under warranty. The equipment offering high quality optical capabilities, enabling extremely precise positioning of even very small components, additionally supported by X-ray inspection equipment, is a perfect solution for most service companies and enables quick, safe and almost automatic repairs of notebooks or game consoles.
Unfortunately, the financial requirements of such an investment exceed the capabilities of many companies.
However, thanks to the latest technological and yet cost-effective hardware solutions, effective and safe work with SMD components, including most BGA, is now possible even at small service sites. Such properties have Reeco devices manufactured in Poland, characterized by very good parameters and quality, and at the same time price at the level of Asian devices with unmatched capabilities and quality.
Currently, Reeco disassembly equipment has already reached its fifth generation. The latest BGA repair kit – Reeco RS-300 is an nearly automatic tool. Having mastered it, the service team gains the possibility of effective repairs from a few to several boards a day. It is even possible to repair the latest devices such as notebooks and game consoles.
DISASSEMBLING SMD-BGA
Standard station equipment allows you to work with most SMDs. In the case of more complex applications, it is advisable to select a head for a specific type of element – the manufacturer provides a wide range of choice and the possibility of producing this element to the desired size.
Precise matching of the head to the component is extremely important, because it is an essential element affecting the uniform temperature distribution over the entire surface of the disassembled system and providing protection for surrounding elements.
Disassembling the elements with this station is extremely simple – just determine the temperature and the amount of air supplied, then from a distance of about 3 cm direct a stream of hot air onto the element to be disassembled and bring the solder to melt at the leads.
Now, what’s left is to lift the element – you can use an independently operating vacuum tweezers. Often, after dismantling the system, it is necessary to reinstall it, e.g. for diagnostic work. In this case, it is easy to recreate” the missing balls – soldering points and install the system according to the saved profile using a properly selected set for component regeneration (template, screen, balls). The whole process is precisely controlled. This is ensured by an advanced microcontroller system supported by modern measuring systems. We achieve high measurement accuracy.
This property together with the advanced controller offers high temperature stability of the air stream. The data presented is very clear thanks to the seven-inch display. Additionally, three measurement channels based on K-type thermocouples are available to the user. They are designed to ensure greater control and repeatability of the assembly/disassembly process of electronic components.
BGA ASSEMBLY
The installation of BGA systems is a much more difficult task, as it means that you have to use advanced tools that offer precise positioning and process guidance according to programmed profiles. It is required to maintain in each zone the set time, temperature and amount of supplied air – a failure to maintain the profile even in one zone usually results in a complete failure.
In such complex tasks, high quality equipment is necessary. The Reeco kit add-on rack ensures that the board is securely fixed and the system is positioned. A large heating surface of A3 sheet size, with two heaters, is very important. The first lower convectional bottom consists of 3 zones with additional air blowing through the openings in the heating surface, the second upper one is based on a ceramic cartridge with infinitely adjustable air flow rate. The heaters fulfill an important function, ensuring even temperature distribution over the entire board and initial preparation of the board and components.
Obtaining the correct soldering profile, usually required by the manufacturer of the BGA system, is necessary for its correct installation or disassembly.
Failure to maintain the set parameters will result in short circuits, gaps or overheating of the component. The work of the whole unit is controlled by the process management software, allowing to create an advanced workstation to meet most of the needs that may arise in the service engineer’s work. Four-zone soldering profiles can now be easily programmed and saved in the memory of the computer or station, and the course of the process can be observed on a graph drawn in real time. Windows-based graphical interface of the application provides intuitive operation and possibility of data archiving.
SERVICING EQUIPMENT
The RS-300 is the fifth generation of Renex service equipment. There have been numerous changes compared to the previous one: a large 7-inch colour touch screen; the ability to view basic process parameters in real time; an integrated device (station + heater) allows you to control the process from a single controller; the ability to work without a computer from an internal controller; communication via USB with an external computer; the ability to program any number of profiles; 3 external thermocouple sockets; smart thermocouple; autoprofile; 3kW lower heater power; 800W upper heater power (or optional 1000 W); audible signalling during operation; intuitive software operation.
Even with minimal skill of the operator, this device can become a service centre, deciding on its technical and economic efficiency. Summit devices of the American manufacturer VJ Electronics are more efficient and quicker to carry out more complex tasks. They are an industry standard for BGA work, and device manufacturers (e.g. almost all notebook manufacturers) develop assembly/disassembly profiles based on work with VJ Electronix devices. Summit enables repair of up to 100 boards per day.
Of course, even the best equipment is not able to perform even the simplest tasks on its own. The most important element in every company is a man and it is his skills that determine the quality of work. The implementation of new technologies should therefore begin primarily by improving the qualifications of people who are to operate the new equipment, so Reeco offer of devices is complemented by an appropriate training offer.
